Checkpoint Technologies builds the leading tools for Laser Based Defect Localization, the specific application of the InfraScan^™ family varies from user to user and device to device. Various techniques available in our tools, these include everything from TIVA and LIVA to OBIC and SEI to LADA.

The flexibility of the InfraScan^™ family allows users to pinpoint process errors, design issues as well a damaged circuits. Listed below are application notes that demonstrate the capability of the InfraScan^™ family.

Click on the following links to view application notes (pdf files)

App Note 10: Imaging of IC along with overlay of TIVA/SEI signal.
App Note 11: High resistance LIVA scan.
App Note 12: Low resistance LIVA scan.
App Note 13: Low resistance TIVA scan.
App Note 14: Intermediate resistance TIVA scan.
App Note 15: High resistance SEI scan.
App Note 16: Metal shorts, spacing failure.
App Note 17: SDL study, using an ATE to isolate defects.
App Note 20: Emission and Laser comparison
App Note 21: ClearView for Backside imaging
Case Study : Metal 2 spacing failures